Surface MEMS Technology:
Over 15 years ago Silicon Light Machines developed a surface MEMS process for ribbon and membrane structures. This process is ideal where high speed motion of nanostructures is required.
Dry Release:
Using a xenon fluoride process, MEMS devices are released in a dry process that eliminates stiction. This permits the manufacturing of small, thin and complex structures with minimal yield loss.
Integrated CMOS:
As an option, a CMOS process can be Integrated into the MEMS process flow. This is perfect for on-board high-speed DACs.
Compatible with
High-Volume Manufacturing:
Silicon Light’s MEMS process can be manufactured in a standard CMOS fab (with the exception of the final release step). This means the MEMS devices can be built on 200mm wafers in a state-of-the-art cleanroom.
Extensive IP and
Engineering Experience:
Silicon Light Machines has over 25 MEMS process patents that can be applied to building your devices. Its staff has over 100 years of combined MEMS engineering experience to support your design efforts.
