Silicon Light


Laser Marking

The use of lasers for industrial marking and materials processing has seen rapid growth in recent years. Here, a high-intensity laser is used to melt, etch, sinter, ablate, or in other way modify the exposed material relative to its surrounding. Until now, the dominant approach in this application has been a single beam rastered over the work surface by galvo scan mirrors. While the focused beam is effective in generating the intensity needed to modify the material, the throughput of such systems is limited as the area is written sequentially using just a single beam. Recent advances in total available laser power are enabling higher productivity alternatives. For example, by replacing the scan mirror with a spatial light modulator, the single beam is turned into hundreds or thousands of beamlets all writing to the surface in parallel. Clearly, this throughput boost requires a spatial light modulator with outstanding power-handling capability. The robust materials-set comprising the GLV position it well to serve this emerging application.